Chip Quik, AD1-200S, Thermoset Chip Glue, Stencil/Print Viscosity, Red, 200g/6oz cartridge
Features:
- Lead-Free
- RoHS 3 Compliant
- REACH Compliant
Heat curing epoxy adhesive designed to bond surface mount chips and ICs to printed circuit boards (PCBs). Higher Viscosity for Stencil Printing. Designed to be printed with stencil and squeegee.
Allows large/heavy surface mount components to be permanently bonded to a PCB during reflow, allowing two sided surface mount reflow without larger chips/ICs coming loose.
Chip Quik AD1 Red Glue Usage Instructions
Chip Quik AD1 Red Glue only works as an adhesive after it has been applied between a part and the PCB, then baked in a reflow oven (which cures the AD1 Red Glue), and then cooled. Before it has been heated (cured), it is slightly sticky, but will not hold parts in place. Once baked and cooled, upon additional reflow cycles, the cured AD1 Red Glue will stay hardened and will help hold heavier parts in place while the solder alloy joints melt and then re-solidify during secondary reflow.
How to Apply and Cure Chip Quik AD1 Red Glue
- First apply solder paste to the top side of your PCB.
- Then apply AD1 Red Glue to the top side under where any heavy parts will be placed.
- Place the top side parts on the PCB.
- Reflow the PCB. Standard leaded and lead-free solder paste reflow cycles will normally be hot enough to fully cure the AD1 Red Glue as well, which requires at least 90-120 seconds at 150-260 Celsius to cure.
- Flip the PCB over.
- Apply solder paste to the bottom side.
- You can also apply AD1 Red Glue to the bottom side under any heavy bottom side parts, if you are ever planning to reflow the PCB for a third reflow cycle, or if you want the added strength of the AD1 Red Glue also holding the bottom side parts on.
- Place the bottom side parts on the PCB.
- Reflow the PCB.
Alternatively, you can switch the order to bottom side first, then top side. Usually, you want to first reflow the side with the lightest components, and reflow the heaviest part side second.
